Semiconductor storage device

ABSTRACT

A nonvolatile memory cell using vertical nanowire (VNW) FETs includes a program element of which a gate is connected to a word line, and a switch element that is provided between the program element and a bit line and of which a gate is connected to the word line. The program element and the switch element are each constituted by one or a plurality of VNW FETs, and these VNW FETs are arranged in a line in a first direction.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation of International Application No.PCT/JP2019/012473 filed on Mar. 25, 2019, which claims priority toJapanese Patent Application No. 2018-071030 filed on Apr. 2, 2018 andNo. 2018-146865 filed on Aug. 3, 2018. The entire disclosures of theseapplications are incorporated by reference herein.

BACKGROUND

The present disclosure relates to a semiconductor memory device providedwith vertical nanowire (VNW) field effect transistors (FETs), and moreparticularly to a layout structure of a nonvolatile memory cell.

For transistors as basic constituents of an LSI, improvement inintegration degree, reduction in operating voltage, and improvement inoperating speed have been achieved thanks to scaling down of the gatelength. Recently, however, an increase in off current due to excessivescaling and the resulting significant increase in power consumption haveraised a problem. To solve this problem, three-dimensional transistorshaving a three-dimensional structure changed from the conventionalplanar structure have been vigorously studied. As one type of suchtransistors, a vertical nanowire FET (hereinafter referred to as a VNWFET as appropriate) has attracted attention.

A semiconductor memory device provided with nonvolatile memory cells isused in many applications. As one type of nonvolatile memory cells,there is a one time programmable (OTP) memory cell, which has a featurethat a state of “1” or “0” is stored in the memory by breakdown of aninsulating film or other means and read therefrom.

U.S. Pat. No. 7,402,855 discloses a configuration of an OTP memory. Inthis configuration, one transistor has a gate oxide film having twoportions different in thickness, and by breaking down the thinnerportion of the gate oxide film, a state of “1” or “0” is stored in thememory.

SUMMARY

There is however no prior art document that discloses a configuration ofan OTP memory using VNW FETs.

An objective of the present disclosure is providing a small-area layoutstructure for a nonvolatile memory cell using VNW FETs.

In the first mode of the present disclosure, a semiconductor memorydevice includes a nonvolatile memory cell, wherein the memory cellincludes a program element of which a gate is connected to a word line,and a switch element that is provided between the program element and abit line and of which a gate is connected to the word line, the programelement and the switch element are each constituted by one or aplurality of vertical nanowire (VNW) FETs, and the VNW FETs constitutingthe program element and the switch element are arranged in a line in afirst direction.

According to the above mode, in a nonvolatile memory cell, the programelement and the switch element are each constituted by one VNW FET or aplurality of VNW FETs. The VNW FETs constituting the program element andthe switch element are arranged in a line in the first direction. Thismakes the layout structure of the memory cell compact, whereby the areacan be kept small.

According to the present disclosure, a small-area layout structure canbe implemented for a nonvolatile memory cell using VNW FETs.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B show an configuration example of a semiconductor memorydevice provided with nonvolatile memory cells according to the first andsecond embodiments, where FIG. 1A is a block diagram of a memory cellarray and FIG. 1B is a circuit diagram of a memory cell.

FIG. 2 is a plan view showing a layout structure of a memory cell arrayaccording to the first embodiment.

FIG. 3 is a cross-sectional view showing the layout structure of FIG. 2.

FIG. 4 is a plan view showing a layout structure of a memory cell arrayaccording to the second embodiment.

FIG. 5 is a cross-sectional view showing the layout structure of FIG. 4.

FIGS. 6A and 6B are cross-sectional views showing layout structures ofmemory cells according to an alteration of the first and secondembodiments.

FIGS. 7A and 7B are cross-sectional views showing layout structures ofmemory cells according to an alteration of the first and secondembodiments.

FIGS. 8A and 8B show an configuration example of a semiconductor memorydevice provided with nonvolatile memory cells according to the thirdembodiment, where

FIG. 8A is a block diagram of a memory cell array and FIG. 8B is acircuit diagram of a memory cell.

FIG. 9 is a plan view showing a layout structure of a memory cell arrayaccording to the third embodiment.

FIG. 10 is a cross-sectional view showing the layout structure of FIG.9.

FIGS. 11A and 11B are cross-sectional views showing layout structures ofmemory cells according to an alteration of the third embodiment.

FIGS. 12A and 12B are cross-sectional views showing layout structures ofmemory cells according to an alteration of the third embodiment.

FIG. 13 is a cross-sectional view showing a layout structure of a memorycell according to an alteration of the third embodiment.

FIG. 14 is another block diagram of the memory cell array according tothe first and second embodiments.

FIGS. 15A and 15B are schematic views showing a basic structure exampleof vertical nanowire FETs, where FIG. 15A is a cross-sectional view andFIG. 15B is a plan view.

FIGS. 16A and 16B are schematic cross-sectional views showing basicstructure examples of vertical nanowire FETs in which localinterconnects are used.

DETAILED DESCRIPTION

Embodiments of the present disclosure will be described hereinafter withreference to the accompanying drawings. In the following embodiments, itis assumed that a semiconductor memory device includes nonvolatilememory cells and the memory cells include so-called vertical nanowireFETs (VNW FETs).

FIGS. 15A and 15B are schematic views showing a basic structure exampleof VNW FETs, where FIG. 15A is a cross-sectional view and FIG. 15B is aplan view. Note that, in FIG. 15B, illustration of metal interconnectsis omitted and, for easy understanding, constituents invisible whenactually viewed from top are illustrated.

As shown in FIGS. 15A and 15B, a p-well 502 and an n-well 503 are formedon a semiconductor substrate 501. Note however that no p-well may beformed when the semiconductor substrate 501 is a p-type substrate. A VNWFET 510 that is an n-type transistor is formed on the p-well 502, and aVNW FET 520 that is a p-type transistor is formed on the n-well 503. Thereference numeral 504 denotes an insulating film, and 505 denotes aninterlayer insulating film.

The VNW FET 510 includes a bottom electrode 511 that is to be asource/drain electrode, a top electrode 512 that is to be a source/drainelectrode, and a nanowire 513 formed vertically (perpendicularly to thesubstrate surface) between the bottom electrode 511 and the topelectrode 512. The bottom electrode 511 and the top electrode 512 aredoped to have n-type conductivity. At least part of the nanowire 513 isto be a channel region. A gate insulating film 515 is formed around thenanowire 513, and a gate electrode 514 is formed around the gateinsulating film 515. The gate electrode 514 may surround the entire ofthe nanowire 513, or may surround only part of the nanowire 513. Whenthe gate electrode 514 surrounds only part of the nanowire 513, the gateinsulating film 515 may be formed on only the portion of the nanowire513 surrounded by the gate electrode 514.

The bottom electrode 511 is connected with a bottom region 516 formed tospread over the top surface of the semiconductor substrate 501. Thebottom region 516 is also doped to have n-type conductivity. A silicideregion 517 is formed on the surface of the bottom region 516. A sidewall518 is formed around the top electrode 512, and a silicide region 519 isformed on the top of the top electrode 512. Note that the sidewall 518and the silicide region 519 may not be formed.

Likewise, the VNW FET 520 includes a bottom electrode 521 that is to bea source/drain electrode, a top electrode 522 that is to be asource/drain electrode, and a nanowire 523 formed vertically between thebottom electrode 521 and the top electrode 522. The bottom electrode 521and the top electrode 522 are doped to have p-type conductivity. Atleast part of the nanowire 523 is to be a channel region. A gateinsulating film 525 is formed around the nanowire 523, and a gateelectrode 524 is formed around the gate insulating film 525.

The bottom electrode 521 is connected with a bottom region 526 formed tospread over the top surface of the semiconductor substrate 501. Thebottom region 526 is also doped to have p-type conductivity. A silicideregion 527 is formed on the surface of the bottom region 526. A sidewall528 is formed around the top electrode 522, and a silicide region 529 isformed on the top of the top electrode 522. Note that the sidewall 528and the silicide region 529 may not be formed.

In the structure of FIGS. 15A and 15B, the gate electrode region 514 ofthe VNW FET 510 and the gate electrode region 524 of the VNW FET 520 aremutually connected through a gate interconnect 531. Also, the bottomregion 516, the silicide region 519, the gate interconnect 531, thesilicide region 529, and the bottom region 526 are individuallyconnected to interconnects 542 formed in a metal interconnect layer M1via contacts 532 and contacts 541. Another metal interconnect layer maybe formed above the metal interconnect layer M1.

The semiconductor substrate 501 is made of any of bulk Si, germanium,and compounds and alloys thereof, for example. Examples of the n-typedopant include As, P, Sb, N, C, and combinations thereof. Examples ofthe p-type dopant include B, BF2, In, N, C, and combinations thereof.The planar shape of the VNW FETs 510 and 520 (transverse sectional shapeof the nanowires 513 and 523) may be a circle, a rectangle, or anellipse, for example.

Examples of the material of the insulating film 504 include SiN andSiCN. Examples of the material of the interlayer insulating film 505include SiO, TEOS, PSG, BPSG, FSG, SiOC, SOG, spin-on polymers, SiC, andmixtures thereof. Examples of the material of the silicide regions 517and 527 include NiSi, CoSi, TiSi, and WSi. Examples of the material ofthe gate electrodes 514 and 524 and the gate interconnect 531 includeTiN, TaN, TiAl, Ti-containing metal, Ta-containing metal, Al-containingmetal, W-containing metal, TiSi, NiSi, PtSi, polysilicon with silicide,and mixtures thereof. Examples of the material of the gate insulatingfilms 515 and 525 include SiON, Si₃N₄, Ta₂O_(5,) Al₂O₃, Hf oxide, Taoxide, and Al oxide. The k value is preferably 7 or higher.

As the material of the silicide regions 519 and 529 provided on the topelectrodes 512 and 522, NiSi, CoSi, MoSi, WSi, PtSi, TiSi, and mixturesthereof may be used. As another configuration, metals such as W, Cu, andAl, alloys such as TiN and TaN, impurity-implanted semiconductors, andmixtures thereof may be used. As the material of the sidewalls 518 and528, SiN, SiON, SiC, SiCN, and SiOCN, for example, may be used.

As the material of the contacts 532, Ti, TiN, Ta, and TaN, for example,may be used. Cu, Cu alloy, W, Ag, Au, Ni, and Al may also be used.Alternatively, Co and Ru may be used.

FIGS. 16A and 16B show basic structure examples of VNW FETs in whichlocal interconnects are used. In FIG. 16A, local interconnects 534 areformed between the metal interconnect layer M1 and the top electrodes512 and 522 of the VNW FETs 510 and 520. The bottom regions 516 and 526and the gate interconnect 531 are individually connected to theinterconnects 542 formed in the metal interconnect layer M1 via contacts533, local interconnects 534, and the contacts 541. The silicide regions519 and 529 are individually connected to the interconnects 542 formedin the metal interconnect layer M1 via the local interconnects 534 andthe contacts 541.

In FIG. 16B, local interconnects 535 are formed between the metalinterconnect layer M1 and the bottom regions 516 and 526. In otherwords, the local interconnect 535 corresponds to an integrated form ofthe contact 533 and the local interconnect 534 in FIG. 16A. Silicideregions 536 are used as an etching stopper in the process of forming thelocal interconnects 535.

In the following description, the bottom electrode, top electrode, andgate electrode of a VNW FET are simply referred to as the bottom, thetop, and the gate, respectively, as appropriate. Also, it is assumedthat, when one or a plurality of configuration units, each constitutedby a vertical nanowire, a top, a bottom, and a gate, constitute one VNWFET, this configuration unit is simply referred to as a “VNW” todistinguish this from the VNW FET. Also, “VDD” refers to a power supplyvoltage or a high voltage-side power supply line, and “VSS” refers to apower supply voltage or a low voltage-side power supply line.

In the following description, in the plan views such as FIG. 2, thehorizontal direction as viewed from the figure is referred to as the Xdirection (corresponding to the first direction) and the verticaldirection as the Y direction (corresponding to the second direction).Also, as used herein, an expression indicating that widths, etc. are thesame, like the “same interconnect width” should be understood asincluding a range of fabrication variations.

First Embodiment

FIGS. 1A and 1B are views showing a configuration example of asemiconductor memory device provided with nonvolatile memory cellsaccording to the first and second embodiments, where FIG. 1A is a blockdiagram of a memory cell array and FIG. 1B is a circuit diagram of amemory cell. As shown in FIG. 1A, memory cells 1 are connected withtheir corresponding word lines WL and bit lines BL. Note that, althoughthe semiconductor memory device is provided with, not only the memorycell array, but also peripheral circuits such as a write circuit and aread circuit, illustration of such circuits is omitted here. Note alsothat, although the memory cell array includes (2×2) memory cells 1 (MC1to MC4) in FIG. 1A for simplification of the illustration, the numbersof memory cells 1 in the X direction (direction in which the word linesWL extend) and in the Y direction (direction in which the bit lines BLextend) are not limited to these.

In this embodiment, the memory cells 1 are one time programmable (OTP)memory cells of a gate oxide film breakdown type. As shown in FIG. 1B,each memory cell 1 includes serially-connected n-type transistors TP andTS. The transistor TP is a program element, which stores a value “1”/“0”depending on the breakdown/non-breakdown state of the gate oxide film.The transistor TS is a switch element, which controls the access fromthe bit line BL to the program element.

Since the transistor TP constituting the program element is an objectsubjected to breakdown of the gate oxide film, the gate oxide filmthereof is thinner than that of the transistor TS constituting theswitch element. Specifically, for example, the switch element isconstituted by a transistor having a gate oxide film thickness of thesame level as that of a so-called IO transistor in an input/outputcircuit for exchanging signals with the outside of the semiconductorintegrated circuit. The program element is constituted by a transistorhaving a gate oxide film thickness of the same level as that of aso-called core transistor in an internal circuit of the semiconductorintegrated circuit. The core transistor is lower in the withstandvoltage of the gate oxide film than the IO transistor.

The write operation of the memory cell 1 is performed in the followingmanner A high voltage VPP that is to be a write voltage is applied to adesired word line WL. The high voltage VPP is a voltage higher than thewithstand voltage of the gate oxide film of the program element, whichis 5 V, for example. Also, 0 V is given to a bit line BL connected to amemory cell 1 in which breakdown of the gate oxide film is intended, anda bit line BL connected to a memory cell 1 in which no breakdown of thegate oxide film is intended is floated. As a result, in the memory cell1 connected to the bit line BL to which 0 V has been given, the switchelement becomes conductive and the gate oxide film of the programelement is broken down under the application of the high voltage VPP.

The read operation of the memory cell 1 is performed in the followingmanner The bit line BL is precharged at 0 V, for example. A voltage VRRlower than the high voltage VPP is applied to a desired word line. Thevoltage VRR is a voltage causing no breakdown of the gate oxide film ofthe program element, which is 1 V, for example. At this time, when thegate oxide film of the program element has been broken down, a currentflows from the word line WL to the bit line BL through the gate of theprogram element, causing a rise in the potential of the bit line BL. Onthe other hand, when the gate oxide film of the program element has notbeen broken down, the potential of the bit line BL remains unchanged.From this difference in potential, the state of the memory cell 1, i.e.,a value “0”/“1” is read.

FIGS. 2 and 3 are views showing a layout structure example of the memorycell array according to the first embodiment, where FIG. 2 is a planview and FIG. 3 is a cross-sectional view taken along line A-A′ in FIG.2. The dashed lines running vertically and horizontally in the planviews such as FIG. 2 and the dashed lines running vertically in thecross-sectional views such as FIG. 3 represent grid lines used forplacement of components at the time of designing. The grid lines arearranged at equal spacing in the X direction and arranged at equalspacing in the Y direction. The grid spacing may be the same, ordifferent from each other, in the X and Y directions. Also, the gridspacing may be different between layers. For example, grid lines for VNWFETs and grid lines for M1 interconnects may be arranged at differentspacing. Further, the components are not necessarily required to lie ongrid lines. It is however preferable to place the components on gridlines from the standpoint of preventing or reducing fabricationvariations. This also applies to the subsequent embodiments.

The device structure according to this embodiment is based on thestructure of FIG. 16A, although it can be a structure based on thestructure of FIG. 15 or FIG. 16B, or based on any other devicestructure. This also applies to the subsequent embodiments. Also, foreasy understanding of the figures, illustration of the wells, the STIs,the insulating films, the silicide layers on the bottoms, the silicidelayers on the tops, and the sidewalls of the tops is omitted. This alsoapplies to the subsequent drawings.

FIG. 2 shows the layout of the (2×2) memory cells MC1, MC2, MC3, and MC4constituting a memory cell array. The memory cells MC1 to MC4 have thesame structure, although the memory cells MC2 and MC4 have structuresinverted horizontally (in the X direction) from the memory cells MC1 andMC3. In each of the memory cells MC1 to MC4, the program element isconstituted by one VNW FET and the switch element is constituted bythree VNW FETs. The adjacent memory cells MC1 and MC2 share a connectingportion with a word line WL, and the adjacent memory cells MC3 and MC4share a connecting portion with a word line WL. Tap portions that supplythe power supply voltage VSS to a p-well or a p-substrate are providedon the side of the memory cells MC1 and MC3 opposite to the memory cellsMC2 and MC4 and also on the side of the memory cells MC2 and MC4opposite to the memory cells MC1 and MC3.

Details of the layout structure will be described hereinafter taking thememory cell MC4 as an example.

Transistors TP1, TS1, TS2, and TS3 are n-type VNW FETs each having oneVNW. The transistor TP1 constitutes the program element, and thetransistors TS1, TS2, and TS3 constitute the switch element. The gateoxide films of the transistors TS1, TS2, and TS3 are thicker than thegate oxide film of the transistor TP1. The transistors TP1, TS1, TS2,and TS3 are arranged in a line in the X direction. A p-substrate lies,or a p-well is formed, under the transistors TP1, TS1, TS2, and TS3.

The transistors having different gate oxide film thicknesses can beformed by only masking corresponding gate oxide film regions at theformation of the gate oxide films thereby forming the films separately.This also applies to the subsequent embodiments.

An M2 interconnect 51 that is to be a word line WL is placed to extendin the X direction above the memory cells MC3 and MC4. An M1interconnect 41 that is to be a bit line BL is placed to extend in the Ydirection above the memory cells MC2 and MC4. Also, an M1 interconnect42 that supplies the power supply voltage VSS is placed to extend in theY direction above the tap portion lying on the right side of the memorycells MC2 and MC4 as viewed from the figure. Likewise, an M2interconnect 52 that is to be a word line WL is placed to extend in theX direction above the memory cells MC1 and MC2. An M1 interconnect 43that is to be a bit line BL is placed to extend in the Y direction abovethe memory cells MC1 and MC3. Also, an M1 interconnect 44 that suppliesthe power supply voltage VSS is placed to extend in the Y directionabove the tap portion lying on the left side of the memory cells MC1 andMC3 as viewed from the figure.

Bottom regions 11, 12, and 13 are formed. The bottoms of the transistorsTP1 and TS1 are connected to the bottom region 11, the bottoms of thetransistors TS2 and TS3 are connected to the bottom region 12, and thebottom region 13 is formed in the corresponding tap portion. The bottomregion 13 is connected to the M1 interconnect 42 that supplies the powersupply voltage VSS, through vias and a local interconnect.

A gate interconnect 21, extending in the X direction, is connected withthe gates of the transistors TP1, TS1, TS2, and TS3. The gateinterconnect 21 has an interconnect portion 21 a extending from the sideof the transistor TP1 opposite to the transistor TS1. The interconnectportion 21 a is connected with the M2 interconnect 51 that is to be aword line WL through vias, a local interconnect, and an M1 interconnect.The interconnect portion 21 a is shared by the adjacent memory cells MC3and MC4.

The tops of the transistors TS1 and TS2 are connected to a localinterconnect 31 extending in the X direction. The top of the transistorTS3 is connected with the M1 interconnect 41 that is to be a bit line BLthrough a local interconnect and a via. That is, the transistors TS1,TS2, and TS3 are serially connected between the bottom region 11 towhich the bottom of the transistor TP1 is connected and the M1interconnect 41 that is to be a bit line BL through the localinterconnect 31 and the bottom region 12.

The layout structure described above has features as follows, forexample. The VNW FETs TP1, TS1, TS2, and TS3 constituting the programelement and the switch element are arranged in a line in the Xdirection. This makes the layout structure of the memory cell compact,whereby the area can be kept small. Also, the gate interconnect 21extending in the X direction is connected with the gates of the VNW FETsTP1, TS1, TS2, and TS3. This makes the layout structure of the memorycell more compact. Further, the M2 interconnect 51 that is to be a wordline WL extends in the X direction, and the VNW FETs TP1, TS1, TS2, andTS3 overlap the gate interconnect 21 and the M2 interconnect 51 asviewed from top. This makes the layout structure of the memory cell morecompact.

In the serially connected transistors TS1, TS2, and TS3 constituting theswitch element, the top of the transistor TS3 is connected with the M1interconnect 41 that is to be a bit line BL. This makes theconfiguration for connection between the switch element and the bit lineBL simple, whereby reduction in the area of the memory cell can berealized.

In the serially connected transistors TS1, TS2, and TS3 constituting theswitch element, the tops of the transistors TS1 and TS2 are mutuallyconnected through the local interconnect 31, and the bottoms of thetransistors TS2 and TS3 are mutually connected through the bottom region12. In this way, by alternately connecting the tops and bottoms of theVNW FETs constituting the switch element, the configuration for serialconnection of the VNW FETs becomes simple. Reduction in the area of thememory cell can therefore be realized.

The interconnect portion 21 a for connecting the gate interconnect 21with the word line WL is provided at an end of the memory cell. Thismakes it possible to share the interconnect portion 21 a with itsadjacent memory cell, whereby reduction in the area of the memory cellcan be realized.

In the M1 interconnect layer, M1 interconnects extending in the Ydirection may be provided in the unoccupied portion between theinterconnect portion 21 a and the M1 interconnect 41. This will make thepattern of the M1 interconnects uniform. Also, by providing power supplyinterconnects as the M1 interconnects, strengthening of power supplywill be possible.

The bottom regions extend in the X direction, and have the same regionwidth and a fixed placement pitch. The gate interconnects extend in theX direction, and have the same interconnect width and a fixedinterconnect pitch. The local interconnects extend in the X direction,and have the same interconnect width and a fixed interconnect pitch. TheM1 interconnects extend in the Y direction, and have the sameinterconnect width and a fixed interconnect pitch. The M2 interconnectsextend in the X direction, and have the same interconnect width and afixed interconnect pitch.

Accordingly, the fabrication precision of the semiconductor memorydevice improves, and variations in device characteristics are preventedor reduced. Note that all the regions or interconnects in each layer donot have to be the same in direction, width, or interconnect pitch.

Second Embodiment

FIGS. 4 and 5 are views showing a layout structure example of a memorycell array according to the second embodiment, where FIG. 4 is a planview and FIG. 5 is a cross-sectional view taken along line B-B′ in FIG.4. Memory cells MC1 to MC4 have the same structure, although the memorycells MC2 and MC4 have structures inverted horizontally (in the Xdirection) from the memory cells MC1 and MC3. In each of the memorycells MC1 to MC4, the program element is constituted by one VNW FET andthe switch element is constituted by three VNW FETs. Tap portions thatsupply the power supply voltage VSS to a p-well or a p-substrate areprovided on the side of the memory cells MC1 and MC3 opposite to thememory cells MC2 and MC4 and also on the side of the memory cells MC2and MC4 opposite to the memory cells MC1 and MC3. Details of the layoutstructure will be described hereinafter taking the memory cell MC4 as anexample.

Transistors TP1, TS1, TS2, and TS3 are n-type VNW FETs each having oneVNW. The transistor TP1 constitutes the program element, and thetransistors TS1, TS2, and TS3 constitute the switch element. The gateoxide films of the transistors TS1, TS2, and TS3 are thicker than thegate oxide film of the transistor TP1. The transistors TP1, TS1, TS2,and TS3 are arranged in a line in the X direction. The transistor TP1 ishowever spaced from the other transistors TS1, TS2, and TS3 by adistance corresponding to one grid cell. A p-substrate lies, or a p-wellis formed, under the transistors TP1, TS1, TS2, and TS3.

An M2 interconnect 51 that is to be a word line WL is placed to extendin the X direction above the memory cells MC3 and MC4. An M1interconnect 41 that is to be a bit line BL is placed to extend in the Ydirection above the memory cells MC2 and MC4. Also, an M1 interconnect42 that supplies the power supply voltage VSS is placed to extend in theY direction above the tap portion lying on the right side of the memorycells MC2 and MC4 as viewed from the figure. Likewise, an M2interconnect 52 that is to be a word line WL is placed to extend in theX direction above the memory cells MC1 and MC2. An M1 interconnect 43that is to be a bit line BL is placed to extend in the Y direction abovethe memory cells MC1 and MC3. Also, an M1 interconnect 44 that suppliesthe power supply voltage VSS is placed to extend in the Y directionabove the tap portion lying on the left side of the memory cells MC1 andMC3 as viewed from the figure.

Bottom regions 111, 112, and 113 are formed. The bottoms of thetransistors TP1 and TS1 are connected to the bottom region 111, thebottoms of the transistors TS2 and TS3 are connected to the bottomregion 112, and the bottom region 113 is formed in the corresponding tapportion. The bottom region 113 is connected to the M1 interconnect 42that supplies the power supply voltage VSS, through vias and a localinterconnect.

A gate interconnect 121, extending in the X direction, is connected withthe gates of the transistors TP1, TS1, TS2, and TS3. The gateinterconnect 121 has an interconnect portion 121 a between thetransistor TP1 and the transistor TS1. The interconnect portion 121 a isconnected with the M2 interconnect 51 that is to be a word line WLthrough vias, a local interconnect, and an M1 interconnect.

The tops of the transistors TS1 and TS2 are connected to a localinterconnect 131 extending in the X direction. The top of the transistorTS3 is connected with the M1 interconnect 41 that is to be a bit line BLthrough a local interconnect and a via. That is, the transistors TS1,TS2, and TS3 are serially connected between the bottom region 111 towhich the bottom of the transistor TP1 is connected and the M1interconnect 41 that is to be a bit line BL through the localinterconnect 131 and the bottom region 112.

The layout structure described above has features as follows, forexample.

The VNW FETs TP1, TS1, TS2, and TS3 constituting the program element andthe switch element are arranged in a line in the X direction. This makesthe layout structure of the memory cell compact, whereby the area can bekept small. Also, the gate interconnect 121 extending in the X directionis connected with the gates of the VNW FETs TP1, TS1, TS2, and TS3. Thismakes the layout structure of the memory cell more compact. Further, theM2 interconnect 51 that is to be a word line WL extends in the Xdirection, and the VNW FETs TP1, TS1, TS2, and TS3 overlap the gateinterconnect 121 and the M2 interconnect 51 as viewed from top. Thismakes the layout structure of the memory cell more compact.

In the serially connected transistors TS1, TS2, and TS3 constituting theswitch element, the top of the transistor TS3 is connected with the M1interconnect 41 that is to be a bit line BL. This makes theconfiguration for connection between the switch element and the bit lineBL simple, whereby reduction in the area of the memory cell can berealized.

In the serially connected transistors TS1, TS2, and TS3 constituting theswitch element, the tops of the transistors TS1 and TS2 are mutuallyconnected through the local interconnect 131, and the bottoms of thetransistors TS2 and TS3 are mutually connected through the bottom region112. In this way, by alternately connecting the tops and bottoms of theVNW FETs constituting the switch element, the configuration for serialconnection of the VNW FETs becomes simple, whereby reduction in the areaof the memory cell can be realized.

The transistor TP1 constituting the program element and the transistorsTS1, TS2, and TS3 constituting the switch element are placed apart fromeach other. Also, the transistor TP1 is adjacent to the transistorconstituting the program element of each of the memory cells MC2 andMC3. The transistors constituting the program elements and thetransistors constituting the switch elements are formed separately sincethey are different in the thickness of the gate oxide film. Therefore,by placing the transistors constituting the program elements and thetransistors constituting the switch elements apart from each other, asin this embodiment, obtained are advantages that the fabricationprecision enhances, the reliability of the semiconductor memory deviceimproves, and the yield improves.

In the M1 interconnect layer, M1 interconnects extending in the Ydirection may be provided in the unoccupied portion between theinterconnect portion 121 a and the M1 interconnect 41 or between theadjacent interconnect portions 121 a. This will make the pattern of theM1 interconnects uniform. Also, by providing power supply interconnectsas the M1 interconnects, strengthening of power supply will be possible.

The bottom regions extend in the X direction, and have the same regionwidth and a fixed placement pitch. The gate interconnects extend in theX direction, and have the same interconnect width and a fixedinterconnect pitch. The local interconnects extend in the X direction,and have the same interconnect width and a fixed interconnect pitch. TheM1 interconnects extend in the Y direction, and have the sameinterconnect width and a fixed interconnect pitch. The M2 interconnectsextend in the X direction, and have the same interconnect width and afixed interconnect pitch.

Accordingly, the fabrication precision of the semiconductor memorydevice improves, and variations in device characteristics are preventedor reduced. Note that all the regions or interconnects in each layer donot have to be the same in direction, width, or interconnect pitch.

(Alteration 1)

While the switch element is constituted by three stages of seriallyconnected transistors in the layout structure according to the first andsecond embodiments described above, the number of stages of connectedtransistors constituting the switch element is not limited to three.

FIGS. 6A and 6B are cross-sectional views showing configurations ofmemory cells according to Alteration 1. In FIG. 6A, the switch elementis constituted by two stages of serially connected transistors TS1 andTS2. The tops of the transistors TP1 and TS1 are connected through alocal interconnect 32, and the bottoms of the transistors TS1 and TS2are connected to a bottom region 14. That is, the transistors TS1 andTS2 constituting the switch element are serially connected between thelocal interconnect 32 to which the top of the transistor TP1constituting the program element is connected and the M1 interconnect 41that is to be a bit line BL through the bottom region 14.

In FIG. 6B, the switch element is constituted by one stage of transistorTS1. The transistors TP1 and TS1 are connected to a bottom region 15.That is, the transistor TS1 constituting the switch element is connectedbetween the bottom region 15 to which the bottom of the transistor TP1constituting the program element is connected and the M1 interconnect 41that is to be a bit line BL.

In the write operation of the memory cell, when the gate oxide film ofthe program element has been broken down under application of the highvoltage VPP, the switch element is exposed to the high voltage VPP atboth ends. For this reason, the source-drain of the switch element needsto withstand the high voltage VPP. By constituting the switch element bya plurality of stages, e.g. three stages, of serially connected VNWFETs, the switch element can be easily made to withstand the highvoltage VPP. Note that, if the source-drain of one VNW FET can withstandthe high voltage VPP, it is acceptable to constitute the switch elementby one stage of transistor as shown in FIG. 6B.

While the alteration examples in FIGS. 6A and 6B are based on the layoutstructure according to the first embodiment, it is also possible tochange the number of stages of connected transistors constituting theswitch element for the layout structure according to the secondembodiment, as in FIGS. 6A and 6B.

(Alteration 2)

In the layout structures according to the first and second embodimentsdescribed above, it is possible to invert the placement positions of theprogram element and the switch element in the X direction.

FIGS. 7A and 7B are cross-sectional views showing configurations ofmemory cells according to Alteration 2. In FIG. 7A, in the memory cellaccording to the first embodiment, the positions of the transistor TP1constituting the program element and the transistors TS1, TS2, and TS3constituting the switch element are inverted in the X direction. In FIG.7B, in the memory cell according to the second embodiment, the positionsof the transistor TP1 constituting the program element and thetransistors TS1, TS2, and TS3 constituting the switch element areinverted in the X direction. Note that the configuration of FIG. 7B isthe same as that of the memory cells MC1 and MC3 in the secondembodiment, except for the tap portion.

Third Embodiment

FIGS. 8A and 8B are views showing a configuration example of asemiconductor memory device provided with nonvolatile memory cellsaccording to the third embodiment, where FIG. 8A is a block diagram of amemory cell array and FIG. 8B is a circuit diagram of a memory cell. Asshown in FIG. 8A, memory cells 3 are connected with their correspondingfirst word lines WLP, second word lines WLR, and bit lines BL. Notethat, although the semiconductor memory device is provided with, notonly the memory cell array, but also peripheral circuits such as a writecircuit and a read circuit, illustration of such circuits is omittedhere. Note also that, although the memory cell array includes (2×2)memory cells 3 (MC1 to MC4) in FIG. 8A for simplification of theillustration, the numbers of memory cells 3 in the X direction(direction in which the bit lines BL extend in this embodiment) and inthe Y direction (direction in which the first and second word lines WLPand WLR extend in this embodiment) are not limited to these.

In this embodiment, also, the memory cells 3 are one time programmable(OTP) memory cells of a gate oxide film breakdown type. As shown in FIG.8B, each memory cell 3 includes serially-connected n-type transistors TPand TS. The transistor TP is a program element, of which the gate isconnected to the first word line WLP. The program element stores a value“1”/“0” depending on the breakdown/non-breakdown state of the gate oxidefilm. The transistor TS is a switch element, of which the gate isconnected to the second word line WLR. The switch element controls theaccess from the bit line BL to the program element. In this embodiment,the switch element and the program element are each constituted by atransistor having a gate oxide film thickness of the same level as thatof a so-called core transistor in an internal circuit of a semiconductorintegrated circuit, for example.

The write operation of the memory cell 3 is performed in the followingmanner A high voltage VPP that is to be a write voltage is applied to adesired first word line WLP. The high voltage VPP is a voltage higherthan the withstand voltage of the gate oxide film of the programelement, which is 3 V, for example. A voltage VPR is applied to thesecond word line WLR. The voltage VPR is a voltage that is lower thanthe withstand voltage of the gate oxide film of the switch element andalso makes the voltage (VPP-VPR) lower than the withstand voltage of thegate oxide film of the switch element, which is 1 V, for example. Also,0 V is given to a bit line BL connected to a memory cell 3 in whichbreakdown of the gate oxide film is intended, and the voltage VPR isapplied to a bit line BL connected to a memory cell 3 in which nobreakdown of the gate oxide film is intended. As a result, in the memorycell 3 connected to the bit line BL to which 0 V has been given, theswitch element becomes conductive and the gate oxide film of the programelement is broken down under the application of the high voltage VPP.

The read operation of the memory cell 3 is performed in the followingmanner The bit line BL is precharged at 0 V, for example. A voltage VRRlower than the high voltage VPP is applied to desired first and secondword lines WLP and WLR. The voltage VRR is a voltage causing nobreakdown of the gate oxide film of the program element, which is 1 V,for example. At this time, when the gate oxide film of the programelement has been broken down, a current flows from the first word lineWLP to the bit line BL through the gate of the program element, causinga rise in the potential of the bit line BL. On the other hand, when thegate oxide film of the program element has not been broken down, thepotential of the bit line BL remains unchanged. From this difference inpotential, the state of the memory cell 3, i.e., a value “0”/“1” isread.

FIGS. 9 and 10 are views showing a layout structure example of thememory cell array according to the third embodiment, where FIG. 9 is aplan view and FIG. 10 is a cross-sectional view taken along line C-C′ inFIG. 9. FIG. 9 shows the layout of the (2×2) memory cells MC1, MC2, MC3,and MC4 constituting the memory cell array. The memory cells MC1 to MC4have the same structure. In each of the memory cells MC1 to MC4, theprogram element is constituted by one VNW FET and the switch element isconstituted by three VNW FETs. Tap portions that supply the power supplyvoltage VSS to a p-well or a p-substrate are provided on the side of thememory cells MC1 and MC3 opposite to the memory cells MC2 and MC4 andalso on the side of the memory cells MC2 and MC4 opposite to the memorycells MC1 and MC3.

Details of the layout structure will be described hereinafter taking thememory cell MC4 as an example.

Transistors TP1, TS1, TS2, and TS3 are n-type VNW FETs each having oneVNW. The transistor TP1 constitutes the program element, and thetransistors TS1, TS2, and TS3 constitute the switch element. In thisembodiment, the gate oxide films of the transistors TP1, TS1, TS2, andTS3 have the same thickness. The transistors TP1, TS1, TS2, and TS3 arearranged in a line in the X direction. A p-substrate lies, or a p-wellis formed, under the transistors TP1, TS1, TS2, and TS3.

An M2 interconnect 251 that is to be a bit line BL is placed to extendin the X direction above the memory cells MC3 and MC4. An M1interconnect 241 that is to be a first word line WLP and an M1interconnect 242 that is to be a second word line WLR are placed toextend in the Y direction above the memory cells MC2 and MC4. The M1interconnects 241 and 242 are placed on both sides of the row of thetransistors TP1, TS1, TS2, and TS3 constituting the program element andthe switch element in the X direction and do not overlap any of thetransistors TP1, TS1, TS2, and TS3 as viewed from top. Also, an M1interconnect 243 that supplies the power supply voltage VSS is placed toextend in the Y direction above the tap portion lying on the right sideof the memory cells MC2 and MC4 as viewed from the figure. Likewise, anM2 interconnect 252 that is to be a bit line BL is placed to extend inthe X direction above the memory cells MC1 and MC2. An M1 interconnect244 that is to be a first word line WLP and an M1 interconnect 245 thatis to be a second word line WLR are placed to extend in the Y directionabove the memory cells MC1 and MC3. Also, an M1 interconnect 246 thatsupplies the power supply voltage VSS is placed to extend in the Ydirection above the tap portion lying on the left side of the memorycells MC1 and MC3 as viewed from the figure.

Bottom regions 211, 212, and 213 are formed. The bottoms of thetransistors TP1 and TS1 are connected to the bottom region 211, thebottoms of the transistors TS2 and TS3 are connected to the bottomregion 212, and the bottom region 213 is formed in the corresponding tapportion. The bottom region 213 is connected to the M1 interconnect 243that supplies the power supply voltage VSS, through vias and a localinterconnect.

A gate interconnect 221, connected with the gate of the transistor TP1,is drawn out from the side of the transistor TP1 opposite to thetransistor TS1. The gate interconnect 221 is connected with the M1interconnect 241 that is to be a first word line WLP through vias and alocal interconnect. A gate interconnect 222, connected with the gates ofthe transistors TS1, TS2, and TS3, is drawn out from the side of thetransistor TS3 opposite to the transistor TS2. The gate interconnect 222is connected with the M1 interconnect 242 that is to be a second wordline WLR through vias and a local interconnect.

The tops of the transistors TS1 and TS2 are connected to a localinterconnect 231 extending in the X direction. The top of the transistorTS3 is connected with the M2 interconnect 251 that is to be a bit lineBL through a local interconnect and vias. That is, the transistors TS1,TS2, and TS3 are serially connected between the bottom region 211 towhich the bottom of the transistor TP1 is connected and the M2interconnect 251 that is to be a bit line BL through the localinterconnect 231 and the bottom region 212.

The layout structure described above has features as follows, forexample.

The VNW FETs TP1, TS1, TS2, and TS3 constituting the program element andthe switch element are arranged in a line in the X direction. This makesthe layout structure of the memory cell compact, whereby the area can bekept small. Also, the M2 interconnect 251 that is to be a bit line BLextends in the X direction, and the VNW FETs TP1, TS1, TS2, and TS3overlap the M2 interconnect 251 as viewed from top. This makes thelayout structure of the memory cell more compact. Further, the M1interconnects 241 and 242 that are to be first and second word lines WLPand WLR extend in the Y direction, i.e., in the direction perpendicularto the row of the VNW FETs TP1, TS1, TS2, and TS3 constituting theprogram element and the switch element. This can prevent or reduceincrease in area caused by the first and second word lines WLP and WLR.

In the serially connected transistors TS1, TS2, and TS3 constituting theswitch element, the top of the transistor TS3 is connected with the M2interconnect 251 that is to be a bit line BL. This makes theconfiguration for the connection between the switch element and the bitline BL simple, whereby reduction in the area of the memory cell can berealized.

In the serially connected transistors TS1, TS2, and TS3 constituting theswitch element, the tops of the transistors TS1 and TS2 are mutuallyconnected through the local interconnect 231, and the bottoms of thetransistors TS2 and TS3 are mutually connected through the bottom region212. In this way, by alternately connecting the tops and bottoms of theVNW FETs constituting the switch element, the configuration for theserial connection of the VNW FETs becomes simple. Reduction in the areaof the memory cell can therefore be realized.

In the M1 interconnect layer, M1 interconnects extending in the Ydirection may be provided in the unoccupied portion between the M1interconnect 241 and the VNW FET TS3. This will make the pattern of theM1 interconnects uniform. Also, by providing power supply interconnectsas the M1 interconnects, strengthening of power supply will be possible.

The bottom regions extend in the X direction, and have the same regionwidth and a fixed placement pitch. The gate interconnects extend in theX direction, and have the same interconnect width and a fixedinterconnect pitch. The local interconnects extend in the X direction,and have the same interconnect width and a fixed interconnect pitch. TheM1 interconnects extend in the Y direction, and have the sameinterconnect width and a fixed interconnect pitch. The M2 interconnectsextend in the X direction, and have the same interconnect width and afixed interconnect pitch.

Accordingly, the fabrication precision of the semiconductor memorydevice improves, and variations in device characteristics are preventedor reduced. Note that all the regions or interconnects in each layer donot have to be the same in direction, width, or interconnect pitch.

While the gate oxide films of the program element and the switch elementwere assumed to have the same thickness, they may have differentthicknesses from each other. Note however that, having the same gateoxide film thickness throughout the program element and the switchelement, it is unnecessary to form the gate oxide films separately,making the fabrication of the semiconductor memory device easy.

(Alteration 3)

While the switch element is constituted by three stages of seriallyconnected transistors in the layout structure according to the thirdembodiment described above, the number of stages of connectedtransistors constituting the switch element is not limited to three, asexemplified in Alteration 1 of the first and second embodiments.

FIGS. 11A and 11B are cross-sectional views showing configurations ofmemory cells according to Alteration 3. In FIG. 11A, the switch elementis constituted by one stage of transistor TS1. The transistors TP1 andTS1 are connected to a bottom region 214. That is, the transistor TS1constituting the switch element is connected between the bottom region214 to which the bottom of the transistor TP1 constituting the programelement is connected and the M2 interconnect 251 that is to be a bitline BL.

In FIG. 11B, the switch element is constituted by two stages of seriallyconnected transistors TS1 and TS2. The tops of the transistors TP1 andTS1 are connected through a local interconnect 232, and the bottoms ofthe transistors TS1 and TS2 are connected to a bottom region 215. Thatis, the transistors TS1 and TS2 constituting the switch element areserially connected between the local interconnect 232 to which the topof the transistor TP1 constituting the program element is connected andthe M2 interconnect 251 that is to be a bit line BL through the bottomregion 215.

(Alteration 4) In the layout structure according to the third embodimentdescribed above, the first and second word lines WLP and WLR are placedon both sides of the row of the program element and the switch elementin the X direction. Instead, one or both of the first and second wordlines WLP and WLR may be placed between the program element and theswitch element.

FIGS. 12A, 12B, and 13 are cross-sectional views showing configurationsof memory cells according to Alteration 4. In these memory cells, switchelements are each constituted by one stage of transistor TS1. In FIG.12A, the M1 interconnect 241 that is to be a first word line WLP isplaced between the transistor TP1 that is the program element and thetransistor TS1 that is the switch element. In FIG. 12B, the M1interconnect 242 that is to be a second word line WLR is placed betweenthe transistor TP1 that is the program element and the transistor TS1that is the switch element. In FIG. 13, both the M1 interconnect 241that is to be a first word line WLP and the M1 interconnect 242 that isto be a second word line WLR are placed between the transistor TP1 thatis the program element and the transistor TS1 that is the switchelement.

In the examples of FIGS. 12A and 12B, the M1 interconnect 241 that is tobe a first word line WLP is avoided from being adjacent to the M1interconnect 245 that is to be a second word line WLR for the adjacentmemory cell on the left as viewed from the figure. This makes itpossible to suppress crosstalk noise between the first word line WLP andthe second word line WLR, and thus permits stable operation of thesemiconductor memory device.

Other Embodiments (No. 1)

In the above embodiments, description was made taking a configuration ofstoring one piece of data in one memory cell as an example. The presentdisclosure is also applicable to a memory cell array in which the samedata is stored in two or more memory cells.

FIG. 14 is another block diagram of the memory cell array according tothe first and second embodiments. In the configuration of FIG. 14, thesame data is stored in two memory cells adjacent in the Y direction andread. For example, the same data is stored in the memory cells MC1 andMC3, and the same data is stored in the memory cells MC2 and MC4. Asimilar configuration is also applicable to the memory cell arrayaccording to the third embodiment.

Examples of specific write and read operations are as follows.

During the write, data is sequentially written into memory cellsconnected to a word line WLA (MC1 and MC2 in FIG. 14) and memory cellsconnected to a word line WLB (MC3 and MC4 in FIG. 14). The procedure ofthe write is similar to that described in the first embodiment. Duringthe read, the voltage VRR is applied to the word lines WLA and WLBsimultaneously. With this, even if the write (breakdown of the gateoxide film) has not been sufficiently done in one of the two memorycells (e.g., MC1 and MC3), a change occurs in the signal on thecorresponding bit line BL by the other memory cell. Thus, the storeddata can be read correctly.

Alternatively, during the write, the high voltage VPP may be applied tothe word lines WLA and WLB simultaneously.

(No. 2)

While the planar shape of the VNWs is a circle in the layout structureexamples described above, it is not limited to a circle. For example,the planar shape of the VNWs can be a rectangle or an oval. When theplanar shape is an oval, for example, the area of the VNWs per unit areawill be larger, allowing a larger amount of current to flow to thetransistors and thus permitting speedup of the semiconductor memorydevice.

When the planar shape of the VNWs is a shape extending long in onedirection like an oval, the direction of the extension is preferablyuniform. Also, the positions of the ends are preferably aligned.

In memory cells, all VNWs are not necessarily required to have the sameshape, but VNWs having different planar shapes may be present in a mixedmanner For example, circular VNWs and oval VNWs may be present in amixed manner.

While one transistor is constituted by one VNW in the embodimentsdescribed above, one transistor may be constituted by a plurality ofVNWs.

According to the present disclosure, a small-area layout structure canbe implemented for a nonvolatile memory cell using VNW FETs. The presentdisclosure is therefore useful for downsizing of semiconductor chips,for example.

What is claimed is:
 1. A semiconductor memory device comprising anonvolatile memory cell, wherein the memory cell includes a programelement of which a gate is connected to a word line, and a switchelement that is provided between the program element and a bit line andof which a gate is connected to the word line, the program element andthe switch element are each constituted by one or a plurality ofvertical nanowire (VNW) FETs, and the VNW FETs constituting the programelement and the switch element are arranged in a line in a firstdirection.
 2. The semiconductor memory device of claim 1, wherein thememory cell includes a gate interconnect that extends in the firstdirection and is connected with gates of the VNW FETs constituting theprogram element and the switch element.
 3. The semiconductor memorydevice of claim 2, wherein the word line extends in the first direction,and the VNW FETs constituting the program element and the switchelement, the gate interconnect, and the word line overlap one another asviewed from top.
 4. The semiconductor memory device of claim 1, whereinthe switch element includes a VNW FET of which a top electrode isconnected with the bit line.
 5. The semiconductor memory device of claim1, wherein the switch element includes serially connected first, second,and third VNW FETs, and top electrodes of the first and second VNW FETsare mutually connected and bottom electrodes of the second and third VNWFETs are mutually connected.
 6. The semiconductor memory device of claim2, wherein the gate interconnect has a first interconnect portionextending from a side of the program element opposite to the switchelement in the first direction, and the word line is connected to thefirst interconnect portion.
 7. A semiconductor memory device comprisinga nonvolatile memory cell, wherein the memory cell includes a programelement of which a gate is connected to a first word line, and a switchelement that is provided between the program element and a bit line andof which a gate is connected to a second word line, the program elementand the switch element are each constituted by one or a plurality ofvertical nanowire (VNW) FETs, and the VNW FETs constituting the programelement and the switch element are arranged in a line in a firstdirection.
 8. The semiconductor memory device of claim 7, wherein thebit line extends in the first direction, and the VNW FETs constitutingthe program element and the switch element and the bit line overlap eachother as viewed from top.
 9. The semiconductor memory device of claim 7,wherein the switch element includes a VNW FET of which a top electrodeis connected with the bit line.
 10. The semiconductor memory device ofclaim 7, wherein the switch element includes serially connected first,second, and third VNW FETs, and top electrodes of the first and secondVNW FETs are mutually connected and bottom electrodes of the second andthird VNW FETs are mutually connected.
 11. The semiconductor memorydevice of claim 7, wherein the first and second word lines extend in asecond direction perpendicular to the first direction.
 12. Thesemiconductor memory device of claim 11, wherein the first and secondword lines do not overlap the VNW FETs constituting the program elementand the switch element as viewed from top.